Although research on Brain Computer Interfaces have evolved with astonishing speed we still dont have practical and lasting solutions in order to become clinically viable solutions. Worldwide scientific experiments have been conducted targeting goals that before were considered almost miraculous within the medical field: provide movements for paraplegics, return sight to the blind and hearing to the deaf, treatment of parkinson, etc. In order to effectively make use of the advantages discovered so far by the international scientific community in the area of BCI is vital to find an interface solution that meets the requirements of long-term biocompatibility without the use of wires or batteries. One of the possible ways of solving this problem is the use of semiconductor biocompatible material Silicon Carbide integrated with a chip designed to use an ultra low power consumption. This project aims to develop the Implantable Neural Interface (INI) to provide a solution of fully biocompatible and wireless brain computer interface.
The project is being conducted in 3 parts and each part produces a new generation of interface. The first generation of this interface has already been produced and is being tested and the other generations are on development. The first generation INI uses cables and is made using 180nm process technology. The second generation is wireless with external antenna and also uses 180nm process technology. The third and final generation of INI interface uses 40nm process technology allowing lower power consumption and enable the use of antena inside the chip layout.
The technology of silicon carbide for biomedical use has been developed and tested by our group in recent years and has been proven very efficient in terms of intra-cortical biocompatibility in both in-vitro and in-vivo experiments. We are currently about to start in-vivo tests with the first generation of INI.
Our group has expertise in design and development of analog and digital chips with ultra low power consumption. For the present design a new model of bio-amplifier circuit was developed to meet the extremely low power consumption demands, since the energy of all interface is provided only by communications RF carrier. The integration between chip DIE and SiC probes are made by COB (chip-on-board) process.
This project is supported by Science Without Borders Program (CAPES/CNPq-Brazil)
Prof. Stephen E. Saddow - University of South Florida, USA
Prof. Mario A. Gazziro - Federal University of ABC
Prof. Dilvan A. Moreira - University of Sao Paulo
Prof. Eduardo Simoes- University of Sao Paulo
Prof. Luciene Covolan - Federal University of Sao Paulo
Jackeline Moraes Malheiros - Federal University of Sao Paulo
Prof. Antonio Carlos Almeida - Federal University of Sao Joao del Rei
Murilo Pessatti - Chipus-IP Company
Paulo Augusto dal Fabbro - Chipus-IP Company
Juan Carlos Mateus Ardila - Chipus-IP Company
Daniel Pasti Mioni - Chipus-IP Company
Prof. João Navarro Soares Jr. - University of Sao Paulo
Prof. Daniel Zanetti de Florio - Federal University of ABC
Prof. Chris Freewin - University of South Florida, USA
Prof. Andre Carlos Ponce de Leon Ferreira de Carvalho - University of Sao Paulo
Students: Carlos Fellip Rabadan Braga - Universidade Federal do ABC